Packaging trade shows and conferences

IC Sensor Technology Expo

organisateur : Reed Exhibitions Japan Limited
25.01.2023 - 27.01.2023 (Tokyo Big Sight, Koto, Japan) -
IC Packaging Technology Expo is a 3 day event being held from 17th January to the 19th January 2018 at the Tokyo Big Sight in Tokyo, Japan. This event showcases product from Packaging Materials industry.